Welcome to dpiX

The world's most advanced X-ray Sensor Arrays ^SM
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Applications

Click below for a current list of technical paper presentations. A discussion of dpiX a-Si Array technology follows.

dpiX Amorphous Silicon (a-Si) X-ray Image Sensor Array Technology

dpiX proprietary amorphous silicon thin-film transistor (TFT) technology, combined with advanced n-i-p photo detector technology, is backed by over 85 patents. Our technology enables digital X-ray sensors to produce film-like resolution in lightweight, compact packaging. Our a-Si arrays are compatible with indirect detection techniques using scintillating materials such as cesium-iodide, and we also offer arrays for use with direct conversion photoconductors.

Each dpiX image sensor contains an array of switching TFTs, one for each pixel. These products are similar to very large integrated circuits, except that they are manufactured onto sheets of glass, instead of purified silicon wafers. In indirect detector arrays, the pixel structure has an additional light-sensitive photodiode in each pixel.

The fabrication of the pixel-addressing matrix for a large-format image sensor array is essentially the same as that used for the active matrix liquid crystal display (AMLCD). Like an AMLCD, a matrix of TFTs is used to address each pixel location.

In the structure of TFT-based large-format image sensor array, data signals are "read out" from the array rather than "written into" it creating a digital file that represents a two-dimensional image. Instead of using voltage levels to adjust the light throughput in a display pixel, each sensor pixels senses a charge and converts it to an electrical signal.

dpiX technology provides arrays that have:

High fill factor
High quantum efficiency
High charge transfer efficiency
Low lag
Low trapped charge
Low line capacitance/resistance

Engineering Strength

dpiX engineers custom designs to meet the exacting requirements of our customers. Our Design and Integration Engineering group spearheads the development of core processes and materials development. Our Process Engineering team performs manufacturing optimization and continuous process improvement. All of our Engineering, Manufacturing and Test teams work closely with our customers to ensure that design, quality and reliability requirements are realized through the entire product lifecycle.

Design Capability

dpiX has successfully designed and implemented many different medical imaging array product designs optimized for different applications. This experience has allowed us to accurately translate pixel design parameters into system performance criteria such as sensitivity, signal-to-noise ratio, dynamic range, response time and defect levels.

Product Specific Process Optimization

Our extensive research and development background includes ongoing partnerships with government, industry and university leaders to explore new a-Si array materials and technologies. We provide custom processing solutions to meet new specifications and process architectures.

Typical Application

A patient or other target is placed between the X-ray source and the dpiX array, which is the heart of the detector subsystem. Digital images captured by the dpiX array are transmitted to a local computer for viewing, then passed on to a secondary computer or server for storage and transmission.